A 0.4 micron fully complementary BiCMOS technology for advanced logic and microprocessor applications

Technical Digest - International Electron Devices Meeting, IEDM

Volumn 1991-January, Issue , 1991, Pages 85-88

  Sun, Shih Wei ^a   Tsui, Paul G Y ^a   Somero, Bradley M ^a   Klein, Jeff ^a   Pintchovski, Fabio ^a   Yeargain, John R ^a   Pappert, Bernie ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER CIRCUITS; ELECTRON DEVICES; MICROPROCESSOR CHIPS; RECONFIGURABLE HARDWARE; SCHOTTKY BARRIER DIODES; SILICIDES;

CIRCUIT APPLICATION; MICROPROCESSOR APPLICATIONS; MODULAR PROCESS; MULTILEVEL METALLIZATION; OPTIMAL DEVICES; PROCESS WINDOW ANALYSIS; SELF ALIGNED SILICIDE PROCESS; SPEED IMPROVEMENT;

BICMOS TECHNOLOGY;

EID: 4244216751     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1991.235418     Document Type: Conference Paper

References (0)