Implementation of a low temperature wafer bonding process for acceleration sensors

Materials Research Society Symposium Proceedings

Volumn 682, Issue , 2001, Pages 103-108

  Wiemer, Maik ^a   Otto, Thomas ^a   Gessner, Thomas ^a,b   Hiller, Karla ^b   Kapser, Konrad ^c   Seidel, Helmut ^c   Bagdahn, Joerg ^d   Petzold, Matthias ^d  

^a FRAUNHOFER IZM   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^c Geschäftsbereich Antrieb and Fahrwerk bei Continental Automotive Systems   (Germany)

^d FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; BOND STRENGTH (CHEMICAL); GYROSCOPES; MEMS; SENSORS;

ACCELERATION SENSORS; MIRROR ARRAYS;

WAFER BONDING;

EID: 4244195806     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-682-n4.6     Document Type: Conference Paper

References (4)

1. M. Wiemer, K. Hiller, T. Gessner, Application of high and low temperature wafer bonding processes for bulkmicromachined components, The 1999 Joint International Meeting, Fifth international symposium on semiconductor wafer bonding: Science, technology and application, (1999) (in press).
2. K. Hiller, R. Hahn, C. Kaufmann, S. Kurth, K. Kehr, T. Gessner, W. Dötzel, M. Wiemer, I. Schubert, Low temperature approaches for fabrication of high frequency microscanners, Proc. of the SPIE, Vol. 3878, 58 (1999)
3. J. Bagdahn, A. Plößl, M. Wiemer, M. Petzold, Measurement of the Local Strength distribution of Directly bonded Silicon Wafers Using the Micro-Chevron-Test, The 1999 Joint International Meeting, Fifth international symposium on semiconductor wafer bonding: Science, technology and application, (1999) (in press).
4. K. Mitani, Silicon wafer bonding: an overwiew., Proc. of the 4th int. symposium on semiconductor wafer bonding: science, technology and application, Vol. 97/36, (1997), pp. 1-12