Temperature and current effects on small-geometry-contact resistance

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1997, Pages 115-118

  Banerjee, Kaustav ^a   Amerasekera, Ajith ^a   Dixit, Girish ^a   Hu, Chenming ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FORCE FILL PLUG CONTACTS; SALICIDE PROCESS;

ALUMINUM; ELECTRIC FIELD EFFECTS; ELECTRIC RESISTANCE; OHMIC CONTACTS; SEMICONDUCTOR DOPING; THERMAL EFFECTS;

MOSFET DEVICES;

EID: 4244137736     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)