Buckling and fracture of thin films under compression

Key Engineering Materials

Volumn , Issue 187 PART 1, 2000, Pages 187-192

  Cotterell, B ^a   Chen, Z ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

Buckling; Compliant Substrate; Cracking; Delamination; Thin Film

Indexed keywords

EID: 4243422173     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

References (6)

1. M.D. Thouless, J. Amer. Ceram. Soc., 76 (1993) p. 2936.
2. H.M. Jensen, Acta Metall. Mater., 41 (1993) p. 601.
3. J.W. Hutchinson and Z. Suo, Advances in Applied Mechanics, 29 (1991) p. 63.
4. J. Dundars, J. Appl. Mech.., 36 (1969) p. 650.
5. M.D. Thouless, J.W. Hutchinson, and E.G. Linger, Acta Metall. Mater., 40 (1992) p. 2639.
6. R.G. Stringfellow and L.B. Freund, Int. J. Solids Struct., 30 (1993) p. 1379.