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Volumn 57-58, Issue , 1997, Pages 365-370
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Strain in silicon below Si3N4 stripes, comparison between SUPREM IV calculation and TEM/CBED measurements
a a b c,d c c c |
Author keywords
Electron Diffraction; Process Simulation; Silicon Nitride; Strain; Stress
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Indexed keywords
COMPUTER SIMULATION;
CRYSTAL LATTICES;
ELASTIC MODULI;
ELECTRON DIFFRACTION;
MASKS;
SILICON WAFERS;
STRAIN;
STRESSES;
TRANSMISSION ELECTRON MICROSCOPY;
DEFECTS;
NITRIDES;
SEMICONDUCTOR DEVICE MANUFACTURE;
SILICON NITRIDE;
THERMOOXIDATION;
CONVERGENT BEAM ELECTRON DIFFRACTION (CBED);
SILICON NITRIDE;
SILICON WAFERS;
CONVERGENT BEAM ELECTRON DIFFRACTION (CBED);
ISOLATION STRUCTURES;
LATTICE STRAIN;
PAD OXIDES;
PROCESS SIMULATIONS;
SILICON NITRIDE FILM;
STRESS TENSORS;
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EID: 4243220258
PISSN: 10120394
EISSN: None
Source Type: Book Series
DOI: None Document Type: Article |
Times cited : (2)
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References (13)
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