On the role of tin in the infiltration of aluminium by aluminium for rapid prototyping applications

Scripta Materialia

Volumn 51, Issue 9, 2004, Pages 905-908

  Sercombe, T B ^a   Schaffer, G B ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

Aluminium; Aluminium nitride; Liquid infiltration; Solid freeform processes

Indexed keywords

ALLOYING; ALUMINUM NITRIDE; BINDERS; DIMENSIONAL STABILITY; HIGH TEMPERATURE APPLICATIONS; INFILTRATION; METALLIC FILMS; RAPID PROTOTYPING; TIN;

LIQUID INFILTRATION; OXIDE FILMS; POLYMER BINDERS; SOLID FREEFROM PROCESSES;

MATERIALS SCIENCE;

EID: 4243078518     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.06.032     Document Type: Article

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