Flip-chip bump-lead fabrication: A review

Russian Microelectronics

Volumn 37, Issue 2, 2008, Pages 107-113

  Zenin, V V ^a   Novokreshchenova, E P ^a   Khishko, O V ^b  

^a VORONEZH STATE TECHNICAL UNIVERSITY   (Russian Federation)

^b OAO Voronezhskii Zavod Poluprovodnikovykh Priborov Sborka   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; DIES; ELECTRONICS PACKAGING; MICROFABRICATION; SOLDERING; SUBSTRATES;

SOLDER BUMPS; SOLDER-BALL; WIRE REFLOW;

FLIP CHIP DEVICES;

EID: 42249112057     PISSN: 10637397     EISSN: None     Source Type: Journal    
DOI: 10.1134/s1063739708020042     Document Type: Article

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