Microstructural stability during low temperature exposure of alloys within the Al-Li-Cu-Mg system

Materials Science and Engineering: A

Volumn 485, Issue 1-2, 2008, Pages 613-620

  Katsikis, S ^a   Noble, B ^a   Harris, S J ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

Al Li; Al Li Cu; Al Li Cu Mg; Strength; Toughness;

Indexed keywords

ELECTRIC CONDUCTIVITY; STRENGTH OF MATERIALS; THERMODYNAMIC STABILITY; TOUGHNESS;

MICROSTRUCTURAL STABILITY;

ALUMINUM ALLOYS;

ALUMINUM ALLOYS; ELECTRIC CONDUCTIVITY; STRENGTH OF MATERIALS; THERMODYNAMIC STABILITY; TOUGHNESS;

EID: 42149188227     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.10.020     Document Type: Article

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