Dielectric studies of water absorption and desorption in epoxy resins: Influence of cure process on behaviour

Polymer International

Volumn 57, Issue 5, 2008, Pages 689-699

  McConnell, Barry K ^a   Pethrick, Richard A ^a  

^a UNIVERSITY OF STRATHCLYDE   (United Kingdom)

Author keywords

Cure; Dielectric relaxation; Epoxy resin; Water adsorption; Water desorption

Indexed keywords

CURING; DEHYDRATION; DENSIFICATION; DESORPTION; DIELECTRIC RELAXATION; DYNAMIC MECHANICAL ANALYSIS; HYDRATION; STRESS CONCENTRATION; THICKNESS MEASUREMENT; WATER ABSORPTION;

AMINE-CURED EPOXY RESINS; DICYANDIAMIDE-CURED EPOXY RESINS; MOISTURE LOSS; MOISTURE UPTAKE;

EPOXY RESINS;

CURING; DEHYDRATION; DENSIFICATION; DESORPTION; DIELECTRIC RELAXATION; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; HYDRATION; STRESS CONCENTRATION; THICKNESS MEASUREMENT; WATER ABSORPTION;

DIELECTRIC PROPERTY; EPOXY RESIN; MOISTURE; TEMPERATURE; THERMAL ANALYSIS;

EID: 42149141311     PISSN: 09598103     EISSN: 10970126     Source Type: Journal    
DOI: 10.1002/pi.2324     Document Type: Article

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