An analytical model for calculating thermal bridge effects in high performance building enclosure

Journal of Building Physics

Volumn 31, Issue 4, 2008, Pages 361-387

  Tenpierik, Martin ^a   Van Der Spoel, Wim ^a   Cauberg, Hans ^a,b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b Cauberg Huygen Consulting Engineers   (Netherlands)

Author keywords

Analytical model; Building components; Linear thermal transmittance; Simulation; Thermal bridging; Vacuum insulation panels

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; THERMAL INSULATION;

LINEAR THERMAL TRANSMITTANCE; VACUUM INSULATION PANELS;

BUILDING COMPONENTS;

EID: 42149118931     PISSN: 17442591     EISSN: 17442583     Source Type: Journal    
DOI: 10.1177/1744259107088008     Document Type: Conference Paper

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