A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

Journal of Applied Polymer Science

Volumn 108, Issue 3, 2008, Pages 2052-2059

  Wu, Wan Lung ^a   Hsu, Kung Chung ^a   Cheng, Wu Hsun ^b  

^a NATIONAL TAIWAN NORMAL UNIVERSITY   (Taiwan)

^b Shinkong Synthetic Fibers Corporation   (Taiwan)

Author keywords

Additives; Dielectric properties; Resins; Synthesis; Thermal properties

Indexed keywords

CURING; NITRATION; PERMITTIVITY;

CURING AGENT; NOVOLAC EPOXY RESINS;

EPOXY RESINS;

CURING (CHEMISTRY); DIELECTRIC PROPERTY; EPOXY RESIN; POLYIMIDE; SYNTHESIS; THERMAL STABILITY;

EID: 42049114015     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.27599     Document Type: Article

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