Effects of heat sink compounds on contact resistance of porous media

Thermal Science

Volumn 11, Issue 4, 2007, Pages 113-124

  Akinyemi, Olukayode D ^a   Sauer, Thomas J ^b  

^a PONTIFICAL CATHOLIC UNIVERSITY OF PARANÁ   (Brazil)

^b AGRICULTURAL RESEARCH SERVICE   (United States)

Author keywords

Bulk density; Contact resistance; Heat sinks; Thermal conductivity; Thermal diffusivity; Water content

Indexed keywords

CONTACT RESISTANCE; HEAT RESISTANCE; HEAT SINKS; POROUS MATERIALS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL DIFFUSIVITY; WATER CONTENT;

BULK DENSITY; CONDITION; DRY CONDITION; HIGH CONDUCTIVITY; LOW CONDUCTIVITY; PACKING DENSITY; POROUS MEDIUM; THERMAL GREASE; THERMAL PROBE;

DIFFUSION;

EID: 41949128845     PISSN: 03549836     EISSN: None     Source Type: Journal    
DOI: 10.2298/TSCI0704113A     Document Type: Article

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