Influence of the thermal treatment during the saw damage etching process on the mechanical stability of multicrystalline silicon wafers

Conference Record of the 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, WCPEC-4

Volumn 1, Issue , 2006, Pages 1085-1087

  Borchert, D ^a   Riepe, S ^a   Kubler R ^b   Beinert, J ^b   Kraft, T ^b   Kleer, G ^b   Petri, S ^c  

^a FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^c Shell Solar Deutschland GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING TESTS; COMPUTER SIMULATION; DAMAGE TOLERANCE; HEAT TREATMENT; MECHANICAL STABILITY; POLYSILICON;

ALKALINE SAW DAMAGE ETCHING; DAMAGE ETCHING PROCESS; MULTICRYSTALLINE SILICON WAFERS; MULTICRYSTALLINE WAFERS;

SILICON WAFERS;

EID: 41749108177     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/WCPEC.2006.279330     Document Type: Conference Paper

References (1)

1. Beinert J., Kübler R., Kordisch H., Könczöl L., Kleer G.: Reduction of breakage losses in silicon-cell processing - Investigations towards an optimization of manufacturing processes. EuroSun2004 Conference (14. intern. Sonnenforum, The 5th ISES Europe Solar Conference), 20. - 23. June 2004, Freiburg, Germany, pp 3-050 - 3-057