Spherical submicron-size copper powders coagulated from a vapor phase in RF induction thermal plasma

Thin Solid Films

Volumn 516, Issue 13, 2008, Pages 4402-4406

  Kobayashi, N ^a,b   Kawakami, Y ^c   Kamada, K ^c   Li, J G ^a   Ye, R ^a   Watanabe, T ^b   Ishigaki, T ^a,b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^c SUMITOMO METAL MINING CO LTD   (Japan)

Author keywords

Hydrogen flow rate; Raw powder feed rate; Reactor pressure; Submicron size copper particle; Thermal plasma; Vapor concentration

Indexed keywords

CONDENSATION; EVAPORATION; PLASMA APPLICATIONS; SUPERSATURATION; THERMAL EFFECTS;

RAW POWDER FEED RATE; REACTOR PRESSURE;

COPPER COMPOUNDS;

EID: 41549167784     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.10.064     Document Type: Article

References (6)

1. Shigeta M., Watanabe T., and Nishiyama H. Thin Solid Films 457 (2004) 192
2. Yoshida T., and Akashi K. Mater. Trans., JIM 22 (1981) 371
3. Girshick S.L., Chiu C.-P., Muno R., Wu C.Y., Yang L., Singh S.K., and McMurry P.H. J. Aerosol Sci. 24 (1993) 367
4. Li Y., and Ishigaki T. J. Am. Ceram. Soc. 84 (2001) 1929
5. Ye R., Ishigaki T., Jurewicz J., Proulx P., and Boulos M.I. Plasma Chem. Plasma Process. 24 (2004) 555
6. Ye R., Proulx P., and Boulos M.I. J. Phys., D, Appl. Phys. 33 (2000) 2154