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Volumn 990, Issue , 2007, Pages
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
[No Author Info available]
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Author keywords
[No Author keywords available]
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Indexed keywords
CURING;
DIELECTRIC MATERIALS;
PERMITTIVITY;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
POLYCRYSTALLINE MATERIALS;
RUTHERFORD BACKSCATTERING SPECTROSCOPY;
MICROSTRUCTURAL MODIFICATION;
STRUCTURAL TRANSFORMATION;
THERMOREFLECTANCE MEASUREMENT;
INTERCONNECTION NETWORKS;
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EID: 41549124678
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Review |
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Times cited : (1)
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References (0)
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