Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator

Journal of Hazardous Materials

Volumn 153, Issue 3, 2008, Pages 1308-1313

  Li, Jia ^a   Xu, Zhenming ^a   Zhou, Yaohe ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Computer simulating; MATLAB; Mixture metal particles; PCB scraps

Indexed keywords

COMPUTER SIMULATION; COPPER; ELECTROSTATIC SEPARATORS; MATLAB;

MIXTURE METAL PARTICLES; PCB SCRAPS;

PRINTED CIRCUIT BOARDS;

ALUMINUM; TIN; ZINC;

COMPUTER SIMULATION; COPPER; ELECTROSTATIC SEPARATORS; MATLAB; PRINTED CIRCUIT BOARDS;

COMPUTER SIMULATION; DESIGN; ELECTRIC FIELD; EXPERIMENTAL STUDY; PARTICLE SIZE; PCB; RECYCLING; THEORETICAL STUDY;

ARTICLE; COMPUTER SIMULATION; ELECTRICITY; HEAVY METAL REMOVAL; THEORETICAL MODEL; WASTE WATER MANAGEMENT;

ALUMINUM; COMPUTER SIMULATION; COPPER; ELECTRONICS; ELECTROSTATICS; MODELS, THEORETICAL; WASTE MANAGEMENT; WASTE PRODUCTS;

EID: 41449106893     PISSN: 03043894     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2007.09.089     Document Type: Article

References (5)

1. Veit H.M., Diehl T.R., et al. Utilization of magnetic and electrostatic separation in the recycling of printed circuit boards scrap. Waste Manage. 25 (2005) 67-74
2. Ehner T. Integrated recycling of non-ferrous metal at Boliden Ltd. IEEE International Symposium on Electronics & the Environment (1998) 42-47
3. Li J., Xu Z., and Zhou Y. Application of corona discharge and electrostatic force to separate metals and nonmetals from crushed particles of waste printed circuit boards. J. Electrostat. 65 (2007) 233-238
4. J. Li, H. Lu, Z. Xu, Y. Zhou, A model for computing the trajectories of the conducting particles from waste printed circuit boards in corona electrostatic separators, J. Hazard. Mater., in press.
5. Younes M., Tilmatine A., Medles K., Rahli M., and Dascalescu L. Numerical modelling of conductive particle trajectories in roll-type electrostatic separators. Conf. Rec. of IEEE/IAS Annual Meeting. Hong Kong (2005) 2601-2606