Mechanical behavior of rectangular plates with functionally graded coefficient of thermal expansion subjected to thermal loading

Journal of Thermal Stresses

Volumn 31, Issue 4, 2008, Pages 368-388

  Chung, Yen Ling ^a   Chang, Hao Xuan ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

FGM plates; Finite element analysis; Fourier series expansion; Functionally graded coefficient of thermal expansion

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; FOURIER SERIES; FUNCTIONALLY GRADED MATERIALS; POISSON RATIO; THERMAL EXPANSION;

FOURIER SERIES EXPANSION; FUNCTIONALLY GRADED COEFFICIENT OF THERMAL EXPANSION;

PLATES (STRUCTURAL COMPONENTS);

EID: 41449090390     PISSN: 01495739     EISSN: 1521074X     Source Type: Journal    
DOI: 10.1080/01495730801912397     Document Type: Article

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