Optimized polysilicon deposition using response surface methodology

Semiconductor International

Volumn 19, Issue 8, 1996, Pages 247-254

  Balasubramanian, N ^a   Kong, Ching Win ^a   Jang, Chuck ^a   Kovelamudi, Ravindra B ^b  

^a Chrtd Semiconduct Mfg LTD   (Singapore)

^b INTEGRATED DEVICE TECHNOLOGY INC   (United States)

Author keywords

Chemical vapor deposition; Polysilicon deposition; Response surface methodology

Indexed keywords

EID: 4143097729     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. S. Wolf, Silicon Processing for VLSI Era, Vol. 3, Lattice Press, Calif., (1995).
2. Ted Kamins, Polycrystalline Silicion for IC Applications, Kluwer Academic Publications, 1988.
3. John Franks, Gary DePinto, Joe Stein berg, Mark Berry and Greg Hogness, Semiconductor International, May 1991, pp. 194-197.
4. J.T. Fanton, Jon Opsal, D.L. Willenborg, S.M. Kelso and Allan Rosencwaig, J. Appl. Phys., 73, 1993, p. 7035.
5. N. Draper and H. Smith, Applied Regression Analysis, Wiley, N.Y. 1981.
6. S. Wolf and R.N. Tauber, Silicon Processing for VLSI era, Vol. 1 Lattice Press, Calif.