Active joining of Ti-6Al-4V with electroplated Cu thin film

Materials Science and Engineering: A

Volumn 381, Issue 1-2, 2004, Pages 39-50

  Li, J H ^a   Lin, R Y ^a  

^a UNIVERSITY OF CINCINNATI   (United States)

Author keywords

Active infrared processing; Intermetallic compounds; Joining affected zone; Joint shear strength; Ti 6Al 4V; Widmanst tten structure

Indexed keywords

COOLING; FILLERS; INFRARED HEATING; X RAY DIFFRACTION ANALYSIS;

COPPER FILLERS; INFRARED PROCESSING;

THIN FILMS;

ARGON; INFRARED RADIATION; JOINT; SHEAR STRENGTH;

EID: 4143065925     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.03.028     Document Type: Article

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