Optimization of global data center thermal management workload for minimal environmental and economic burden

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 1, 2008, Pages 39-45

  Shah, Amip J ^a,b   Krishnan, Nikhil ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b HEWLETT PACKARD LABORATORIES   (United States)

^c Columbia University ^*  (United States)

Author keywords

Data center; Electronics cooling; Environmental sustainability; Thermal management

Indexed keywords

INDUSTRIAL ECONOMICS; INDUSTRIAL ELECTRONICS; INFORMATION TECHNOLOGY; OPTIMIZATION; SUSTAINABLE DEVELOPMENT; TEMPERATURE CONTROL;

DATA CENTER; ELECTRONICS COOLING; ENVIRONMENTAL SUSTAINABILITY;

COOLING;

EID: 41349117428     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.906721     Document Type: Article

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