Analysis of failure mechanism in anisotropic conductive and non-conductive film interconnections

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 1, 2008, Pages 65-73

  Kim, Jong Woong ^a   Kim, Dae Gon ^b   Lee, Young Chul ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Semiconductor Material RandD Center   (South Korea)

Author keywords

Anisotropic conductive film (ACF); Contact resistance; Flip chip; Non conductive film (NCF); Reflow

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; ANISOTROPY; CONDUCTIVE FILMS; CONTACT RESISTANCE; CRACK INITIATION; FAILURE (MECHANICAL); SWELLING;

ANISOTROPIC CONDUCTIVE FILM (ACF); BONDING FORCE; CONNECTION RESISTANCE; NON-CONDUCTIVE FILM;

FLIP CHIP DEVICES;

EID: 41349093380     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.910128     Document Type: Article

References (19)

1. Y. H. Liu and K. L. Lin, "Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration," J. Mater. Res., vol. 20, pp. 2184-2193, 2005.
2. J. W. Kim, D. G. Kim, W. S. Hong, and S. B. Jung, "Evaluation of solder joint reliability in flip chip packages during accelerated testing," J. Electron. Mater., vol. 34, pp. 1550-1557, 2005.
3. J. W. Kim and S. B. Jung, "Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints," Mater. Sci. Eng. A, vol. 371, pp. 267-276, 2004.
4. Y. L. Zhang, D. X. Q. Shi, and W. Zhou, "Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading," Microelectron. Reliab., vol. 46, pp. 409-420, 2006.
5. W. J. Plumbridge, "Long term mechanical reliability with lead-free solders," Solder. Surf. Mount Technol., vol. 16, pp. 13-20, 2004.
6. Y. Li and C. P. Wong, "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications," Mater. Sci. Eng. Reliab., vol. 51, pp. 1-35, 2006.
7. M. J. Yim and K. W. Paik, "Design and understanding of anisotropic conductive films (ACF's) for LCD packaging," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol. 21, no. 2, pp. 226-234, Jun. 1998.
8. Y. Chen and C. A. Schuh, "Diffusion on grain boundary networks: Percolation theory and effective medium approximations," Acta Mater. vol. 54, pp. 4709-4720, 2006.
9. D. Klosterman, L. Li, and J. E. Morris, "Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol. 21, no. 1, pp. 23-31, Mar. 1998.
10. L. K. Teh, E. Anto, C. C. Wong, S. G. Mhaisalkar, E. H. Wong, P. S. Teo, and Z. Chen, "Development and reliability of non-conductive adhesive flip-chip packages," Thin Solid Films, vol. 462-463, pp. 446-453, 2004.
11. H. Yu, S. G. Mhaisalkar, and E. H. Wong, "Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects," J. Mater. Res., vol. 20, pp. 1324-1329, 2005.
12. G. R. Ruschau, S. Yoshikawa, and R. E. Newnham, "Resistivities of conductive composites," J. Appl. Phys., vol. 72, pp. 953-959, 1992.
13. W. S. Kwon, S. J. Ham, and K. W. Paik, "Deformation mechanism and its effect on electrical conductivity of ACE flip chip package under thermal cycling condition: An experimental study," Microelectron. Reliab. vol. 46, pp. 589-599, 2006.
14. W. S. Kwon and K. W. Paik, "Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis," Int. J. Adh. Adh., vol. 24, pp. 135-142, 2004.
15. J. Maattanen, "Contact resistance of metal-coated polymer particles used in anisotropically conductive adhesives," Solder. Surf. Mount Technol., vol. 15, pp. 12-15, 2003.
16. C. N. Oguibe, S. H. Mannan, D. C. Whalley, and D. J. Williams, "Conduction mechanisms in anisotropic conducting adhesive assembly," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol. 21, no. 2, pp. 235-242, Jun. 1998.
17. J. W. Kim and S. B. Jung, "Behavior of anisotropic conductive film joints bonded in various forces under temperature fluctuation," J. Electron. Mater. Jul. 2007 [Online]. Available: http:// www.springerlink.com/content/u9320m54p2335h26/
18. J. W. Kim and S. B. Jung, "Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process," Mater. Sci. Eng. A, vol. 452-453, pp. 267-272, 2007.
19. M. Chin, J. R. Barber, and S. J. Hu, "Effect of elastic recovery on the electrical contact resistance in anisotropic conductive adhesive assemblies," IEEE Trans. Compon. Packag. Technol., vol. 29, no. 1, pp. 137-144, Mar. 2006.