Efficient micro machining with high average power picosecond lasers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6881, Issue , 2008, Pages

  Weiler, S ^a   Stute, U ^a   Massa, S ^a   Buettner, S ^a   Faisst, B ^a  

^a TRUMPF LASER UND SYSTEMTECHNIK GMBH   (Germany)

Author keywords

Ablation threshold; Micro machining; Picosecond; Ultrafast

Indexed keywords

LASER ABLATION; MICROMACHINING; WAVELENGTH;

ABLATION THRESHOLD; OUTPUT POWERS;

ULTRASHORT PULSES;

EID: 41149157427     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.761770     Document Type: Conference Paper

References (5)

1. Breitling, D.; Ruf, A.; Dausinger, F.: "Fundamental aspects in machining of metals with short and ultrashort laser pulses"; Proc. of SPIE 5339, 49-63 (2004)
2. Le Drogoff et al., "Laser-ablated volume and depth as a function of pulse duration in aluminum targets", Appl. Opt. 44, 278 (2005)
3. J. Kleinbauer, D. Eckert, S. Weiler, D. H. Sutter, " 80 W ultrafast CPA-free disk laser", paper 6871-44, in Solid State Lasers XVII: Technology and Devices, Proceedings of SPIE Vol. 6881 (San Jose, 2008).
4. Mannion et al., "Ablation thresholds in ultrafast laser micro-machining of common metals in air", Proc. of SPIE 4876, 82003 (2003)
5. http://www.fgsw.de/homepage/leistungen/produkte/mikrobearbeitung/ wendelbohroptik/HDO-Fiyer_TGSW_2007.pdf