Laser-induced cleavage of LCD glass as full-body cutting

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6880, Issue , 2008, Pages

  Karube, Kojiro ^a   Karube, Norio ^a  

^a LEMI Co Ltd   (Japan)

Author keywords

Cullet and micro crack free; FPD glass; Full body cleavage; High accuracy cleavage; High speed cleavage; Laser beam half transparent and absorptive in glass; Profile cutting; Rare earth element doping; Size effects; Thermal stress

Indexed keywords

GLASS; GRINDING (MACHINING); LIQUID CRYSTAL DISPLAYS; MICROCRACKS;

HIGH ACCURACY CLEAVAGE; HIGH SPEED CLEAVAGE; SURFACE ABSORPTION;

LASER DAMAGE;

EID: 41149140302     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.759025     Document Type: Conference Paper

References (4)

1. V. S. Kondratenko, "Method of splitting non-metallic materials," US Patent 5,609,284, (Mar. 11, 1997).
2. H. Hesener, "Method for cutting components made of glass, ceramic, glass ceramic or the like by generating thermal ablation on the component along a cut zone," International Patent WO 02/48059 A1, (20.06.2002).
3. N. Karube and H. Miura, "Full-body laser scribing method of fragile material," US Patent Application Publication US2007/0062921 A1, (Mar. 22, 2007).
4. G. R. Irwin, "Handbuch der Physik," Vol VI, Springer, Berlin, (1958).