Effect of processing conditions on the bonding quality of FDM polymer filaments

Rapid Prototyping Journal

Volumn 14, Issue 2, 2008, Pages 72-80

  Sun, Q ^a   Rizvi, G M ^b   Bellehumeur, C T ^c   Gu, P ^c  

^a Jacobs Canada Inc   (Canada)

^b UNIVERSITY OF ONTARIO INSTITUTE OF TECHNOLOGY   (Canada)

^c UNIVERSITY OF CALGARY   (Canada)

Author keywords

Bonding; Creep; Sintering; Thermal testing

Indexed keywords

BONDING; DEPOSITION; MECHANICAL PROPERTIES; SINTERING;

BONDING QUALITY; FDM POLYMER FILAMENTS;

POLYMERS;

EID: 41149127851     PISSN: 13552546     EISSN: None     Source Type: Journal    
DOI: 10.1108/13552540810862028     Document Type: Article

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