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Volumn , Issue , 2006, Pages 108-109
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High-performance Cu-interconnects with novel seamless low-k SiOCH stacks (SEALS) featured by compositional modulation process for 45nm-node ULSI devices
a a a a a b b a a b a a a a a a a a b b more..
a
NEC CORPORATION
(Japan)
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Author keywords
45nm node interconnects; CMOS ring oscillator; Low k design
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Indexed keywords
BUFFER LAYERS;
CMOS INTEGRATED CIRCUITS;
OSCILLATORS (ELECTRONIC);
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
PLASMA ETCHING;
ULSI CIRCUITS;
COMPOSITIONAL MODULATION PROCESS;
INTERCONNECTS;
LOW-K DESIGN;
INTERCONNECTION NETWORKS;
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EID: 41149106436
PISSN: 07431562
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (6)
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References (7)
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