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Volumn , Issue , 2006, Pages 108-109

High-performance Cu-interconnects with novel seamless low-k SiOCH stacks (SEALS) featured by compositional modulation process for 45nm-node ULSI devices

Author keywords

45nm node interconnects; CMOS ring oscillator; Low k design

Indexed keywords

BUFFER LAYERS; CMOS INTEGRATED CIRCUITS; OSCILLATORS (ELECTRONIC); PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; ULSI CIRCUITS;

EID: 41149106436     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (6)

References (7)
  • 6
    • 41149180597 scopus 로고    scopus 로고
    • MRS, p
    • F. Ito, et al., Proc. AMC 2004 (MRS), p381(2004).
    • (2004) Proc. AMC , pp. 381
    • Ito, F.1
  • 7


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.