Flex reliability of RFID inlays assembled by anisotropic conductive adhesive

Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

Volumn , Issue , 2007, Pages

  An, Bing ^a   Cai, Xiong Hui ^a   Chu, Hua Bin ^a   Lai, Xiao Wei ^a   Wu, Feng Shun ^a   Wu, Yi Ping ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CONDUCTIVE FILMS; COST REDUCTION; ELECTRIC RESISTANCE; PROBLEM SOLVING;

ANISOTROPIC CONDUCTIVE ADHESIVE (ACA); CONDUCTIVE LAYERS;

RADIO FREQUENCY IDENTIFICATION (RFID);

EID: 41049101022     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2007.4283562     Document Type: Conference Paper

References (3)

1. Wu Yiping, "RFID Tag Manufacturing," Global SMT & Packaging (Chinese Version), Vol.4, No.6, 2004, pp. 4-7. [In Chinese]
2. S. Gillissen et.al. Low temperature snap cure thermoset adhesives with good worklife. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2005. 23-26 Oct. 2005. pp. 166-170.
3. B. An, H.B. Chu, J.Q. He, J. Wang, L. Hua, F.S. Wu, Y.P. Wu. Low cost smart labels assembled by anisotropically conductive adhesive. 8th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06). Shanghai, China, JUN 27-30, 2006, pp55-58.