Dual-curable acrylic pressure-sensitive adhesives based on UV and thermal processes

Macromolecular Research

Volumn 16, Issue 2, 2008, Pages 128-133

  Kim, Yang Bae ^a   Park, Su Cheol ^b   Kim, Hyun Kyoung ^b   Hong, Jin Who ^b  

^a Q Sys Co Ltd   (South Korea)

^b Chosun University   (South Korea)

Author keywords

Acrylic; Cure hardening; Polyurethane; Pressure sensitive adhesives; UV

Indexed keywords

EID: 41049100151     PISSN: 15985032     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03218841     Document Type: Article

References (16)

1. J. K. Kim, J. W. Kim, M. I. Kim, and M. S. Song, Macromol. Res., 14,517(2006).
2. D. Satas, in Handbook of Pressure Sensitive Adhesive Technology, D. Satas, Ed., Van Nostrand Reinhold, New York, 1999, pp 1-21.
3. I. Benedek, and L. J. Heymans, in Pressure Sensitive Adhesive Technology, Marcel Dekker, New York, 1997, pp 1-3.
4. D. V. Varanese, Adhesives Age, 4, 2 (2000).
5. R. Malik, RadTech Report, May/June, 25 (2001).
6. Y. B. Kim, H. K. Kim, and J. W. Hong, J. Appl. Polym. Sci., 102, 5566 (2006).
7. J. D. Cho and J. W. Hong, Macromol. Res., 13, 362 (2005).
8. A. Dobman, in New Development and Applications in UV Curable Hotmelt Pressure Sensitive Adhesives, Afera Seminar, Netherlands, September (2002).
9. K. Studer, C. Decker, E. Beck, and R. Schwalm, Eur. Polym. J,41,157(2004).
10. C. Decker, F. Masson, and R. Schwalm, Macromol. Mater. Eng., 288, 17(2003).
11. Z. Czech, Eur. Polym. J., 40, 2221 (2004).
12. Z. Czech, J. Appl. Polym. Sec., 87,1354 (2003).
13. K. H Schumacher, H. Lim, and T. Tsukamoto, Proceedings of RadTech Asia, 512 (2003).
14. T. Scherzer, A. Tauber, and R. Mehnert, Vibrational Spectroscopy, 29, 125 (2002).
15. N. S. Allen, M. S. Johnson, P. K. T. Oldering, and S. Salim, in Chemistry & Technology of UV& EB Formulation for Coatings, Inks & Paints, P. K. T. Oldring, Ed., SITA Technology, 1991, Vol. 2, pp 153-156.
16. A. Zoel, J. Adhesion, 34, 201 (1991).