DRIE, an enabling technology for high density packaging

Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

Volumn , Issue , 2007, Pages

  Lea, Leslie ^a   Barker, Lilian ^a   Hopkins, Janet ^a  

^a Surface Technology Systems plc   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

REACTIVE ION ETCHING; TECHNOLOGY TRANSFER;

ENABLING TECHNOLOGY; HIGH DENSITY PACKAGING; PLASMA PROCESSING EQUIPMENT;

ELECTRONICS PACKAGING;

EID: 41049090445     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2007.4283587     Document Type: Conference Paper

References (2)

1. Chambers A. A. "Silicon Micro-Machining as an Enabling Technology for Advanced Device Packaging", Semiconductor Manufacturing Magazine, November 2004.
2. Laermer F. and Schilp A. "Method for anisotropically etching silicon", German patent DE4241045 (1992).