High-index materials research key to extending immersion lithography

Solid State Technology

Volumn 51, Issue 2, 2008, Pages 28-33

  Rice, Bryan J ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LITHOGRAPHY; RESEARCH AND DEVELOPMENT MANAGEMENT; SEMICONDUCTOR MATERIALS;

HIGH-INDEX MATERIALS RESEARCH; WATER-BASED IMMERSION LITHOGRAPHY;

MATERIALS SCIENCE;

EID: 40749088922     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (25)

1. L.J. Chen, et al., "Immersion Effect on Across-wafer Focus Performance," 4th International Symposium on Immersion Lithography, Keystone, CO, 2007.
2. T. Kono, et al., "Implementation of Immersion Lithography to NAND/CMOS Device Manufacturing," ibid.
3. J-Y. Toon, et al., "Studies on the Defectivity of 193nm Immersion Lithography for Sub-50nm Node and Beyond," ibid.
4. Y. Borodovsky, "Power of One," 2007 MNE Conference, Copenhagen, Denmark.
5. L. Partier, et al., "Development Progress of High-refractive LuAG for Hyper NA Immersion Systems," 4th International Symposium on Immersion Lithography, Keystone, CO, 2007.
6. J. Burnett, et al., "High-index Materials for 193nm Immersion Lithography," 3rd International Symposium on Immersion Lithography, October 2006.
7. R. French, et al., "Cost-effective Single-exposure Immersion Lithography with Second-generation Immersion Fluids for Numerical Apertures of 1.55 and 32nm Half Pitches," 4th International Symposium on Immersion Lithography, Keystone, CO, 2007.
8. T. Furukawa, et al., "High-refractive Index Fluids and Top Coat Design for Next-generation ArF Immersion Lithography," ibid.
9. E. P. Giannelis, et al., "High-refractive Index Nanoparticle Fluids for 193nm Immersion Lithography," ibid.
10. P. A. Zimmerman, "Challenges for Development of High-index Fluids and Resists for Generation-3 193nm Immersion Lithography," ibid.
11. J. Lopez Gejo, et al., "Outlook for Potential Third-generation Fluids," Proc. of SPIE, Vol. 6519.
12. J. Hoffnagle, et al., "Fundamental Analysis of Nanoparticle-based High-index Immersion Fluids," 4th International Symposium on Immersion Lithography, Keystone, CO, 2007.
13. D. Sanders, et al., "New Materials for Surface Energy Control of 193nm Photoresists," ibid.
14. H. Sewell, et al., "High-n Immersion Lithography," ibid.
15. K. Sakai, et al., "Feasibility Study of Immersion System Using a High-index Fluid," ibid.
16. Y. Ohmura, et al., "Development Progress of High-index Immersion Lithography," ibid.
17. A. K. Whittaker, et al., "High-refractive Index Resists for Generation 2 and 3 193i: Where Are We and Where Can We Go?" ibid.
18. H.C. Kim, Samsung comments during Double Patterning Panel Discussion, ibid.
19. C. Wagner, et at.,"Immersion for 40nm Production with 1.35NA," ibid.
20. A. J. Hazelton, et al., "Immersion Lithography in Mass Production: Latest Results for Nikon Immersion Exposure Tools," ibid.
21. M. Kobayashi, et al., "FPA-7000AS7: An Immersion Exposure System for 45nm Node Mass Production," ibid.
22. S. Tarutani, et al., "Development of Materials and Processes for 32nm Node Immersion Lithography Process," ibid.
23. J. Byers, et al., "Double-exposure Materials: Simulation Study of Feasibility," Photopolymers Japan 2007.
24. J. Byers, et al., "Update on Double-exposure Materials Development," 4th International Symposium on Immersion Lithography, Keystone, CO, 2007.
25. G. Willson, et al., "Double Exposure vs. Double Patterning," NEO Litho Workshop, September 2007.