Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 199-202

  Jeong, Youchul ^a   Kim, Hyungsoo ^a   Kim, Jingook ^a   Park, Jongbae ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; JITTER; POLYCHLORINATED BIPHENYLS;

FREQUENCY AND TIME DOMAINS; JITTER MEASUREMENTS; LOW JITTERS; MIXED-MODE SYSTEMS; MULTI-LAYERED PACKAGE; NOISE ISOLATION;

TIME DOMAIN ANALYSIS;

EID: 40649116525     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250031     Document Type: Conference Paper

References (1)

1. Wei Cui, Jun Fan, Yong Ran, Hao Shi, Drewniak, J.L., DuBroff, R.E., "DC Power-bus noise isolation with power-plane segmentation", Electromagnetic Compatibility, IEEE Transactions on, Volume: 45 Issue: 2, May 2003, pp 436-443.