High aspect ratio via etch development for Cu nails in 3-D-stacked ICs

Thin Solid Films

Volumn 516, Issue 11, 2008, Pages 3502-3506

  Van Aelst, J ^a   Struyf, H ^a   Boullart, W ^a   Vanhaelemeersch, S ^a  

^a IMEC   (Belgium)

Author keywords

3 D via etch; Bosch; Deep Si etch; High aspect ratio

Indexed keywords

ASPECT RATIO; OPTIMIZATION; POLYMERS; SURFACE ROUGHNESS;

HIGH ASPECT RATIO; PASSIVATION POLYMERS;

INTEGRATED CIRCUITS;

EID: 40649089415     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.08.079     Document Type: Article

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