Stress-induced effects in electronic characteristics of n-type MOSFETs in resin-molded packages

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 277-284

  Koganemaru, Masaaki ^a   Ikeda, Toru ^b   Miyazaki, Noriyuki ^b   Tomokage, Hajime ^c  

^a FUKUOKA INDUSTRIAL TECHNOLOGY CENTER   (Japan)

^b KYOTO UNIVERSITY   (Japan)

^c FUKUOKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

RESIN-MOLDED PACKAGES; SILICON CHIP; TRANSCONDUCTANCE SHIFTS;

DRAIN CURRENT; MOSFET DEVICES; THRESHOLD VOLTAGE; TRANSCONDUCTANCE;

ELECTRONICS PACKAGING;

EID: 40549119222     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33533     Document Type: Conference Paper

References (22)