Evaluation on use of thermoelectric devices for electronics cooling

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 199-203

  De Bock, H Peter J ^a   Icoz, Tunc ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS COOLING; HEAT PRODUCTION; THERMOELECTRIC COOLING;

COOLING; HEAT FLUX; HEAT GENERATION;

THERMOELECTRIC EQUIPMENT;

EID: 40449131434     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33154     Document Type: Conference Paper

References (10)