High resolution die stress mapping using arrays of CMOS sensors

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 285-295

  Chen, Yonggang ^a   Jaeger, Richard C ^a   Suhling, Jeffrey C ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS SENSOR ARRAYS; HIGH RESOLUTION DIE STRESS MAPPING; MOSIS TINY CHIPS;

CMOS INTEGRATED CIRCUITS; CONFORMAL MAPPING; DIES; FINITE ELEMENT METHOD; STRESS MEASUREMENT;

SILICON SENSORS;

EID: 40449128142     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33569     Document Type: Conference Paper

References (39)