CMOS compatible wafer-scale encapsulation with MEMS resonators

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 499-504

  Kim, Bongsang ^a   Hopcroft, Matthew A ^a   Melamud, Renata ^a   Jha, Chandra M ^a   Agarwal, Manu ^a   Chandorkar, Saurabh A ^a   Kenny, Thomas W ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

RESONATOR STABILITY; TEMPERATURE COEFFICIENT; WAFER-SCALE ENCAPSULATION;

CMOS INTEGRATED CIRCUITS; FABRICATION; RESONATORS; THERMODYNAMIC STABILITY; WAFER BONDING;

MEMS;

EID: 40449106285     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33234     Document Type: Conference Paper

References (14)