Multidisciplinary heat generating logic block placement optimization using genetic algorithm

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 773-779

  Suwa, Tohru ^a   Hadim, Hamid ^a  

^a Stevens Institute of Technology   (United States)

Author keywords

Genetic algorithm; Logic block placement; Multidisciplinary optimization; Superposition; Thermal; Wiring length

Indexed keywords

LOGIC BLOCKS; SILICON CHIPS;

GENETIC ALGORITHMS; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; OPTIMIZATION; TEMPERATURE DISTRIBUTION;

HEAT GENERATION;

EID: 40449089376     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33443     Document Type: Conference Paper

References (15)