Dominant structural factors of local residual stress in three-dimensionally stacked LSI chips mounted using flip chip technology

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 473-479

  Ueta, Nobuki ^a   Miura, Hideo ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC FUNCTIONS; PERIODIC STRESS; STACKED STRUCTURE; STRESS-SENSING CHIPS;

FLIP CHIP DEVICES; LSI CIRCUITS; STRAIN CONTROL; STRAIN GAGES; STRESS CONCENTRATION;

RESIDUAL STRESSES;

EID: 40449087241     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33402     Document Type: Conference Paper

References (14)