New method to improve electrical characteristics of low-k dielectrics in Cu-damascene interconnections

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 699-704

  Kato, I ^a   Sekiyama, S ^a   Takeshiro, S ^a   Fukuda, T ^a   Yanazawa, H ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BLANKET FILMS; DAMASCENE INTERCONNECTION STRUCTURES; MOISTURE EFFECTS; ORGANIC FILMS;

CARBON DIOXIDE; COPPER; ELECTRIC BREAKDOWN; LOW TEMPERATURE EFFECTS; MOISTURE; SUPERCRITICAL FLUIDS;

DIELECTRIC MATERIALS;

EID: 4043165704     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. T. Ohba, presented at the 203th ECS Meeting, abs. No. L1-960, Paris, France, 2003.
2. I. Kato, presented at the 203th ECS Meeting, abs. No. F2-426, Paris, France, 2003.