Improvement in Cu-CMP technology for 90-nm nodes

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 127-132

  Konishi, Nobuhiro ^a   Yamada, Youhei ^a   Noguchi, Junji ^a   Tanaka, Uitsu ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYST SELECTIVITY; CRYSTAL STRUCTURE; ELECTRODEPOSITION; OPTIMIZATION; RELIABILITY; SILICON COMPOUNDS;

CHEMICAL MECHANICAL POLISHING (CMP); INTERCONNECT RELIABILITY; NODES; PROCESS FLOWS;

COPPER;

EID: 4043116429     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. J. Noguchi, et al., IRPS 2003, P287.