Rapid die heating for low-stress die attach

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 2, 2004, Pages 153-162

  Frutschy, Kris J ^a   Rangaraj, Sudarshan V ^a   Dias, Rajen C ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Die attach; Nonisothermal; Thermomechanical stress

Indexed keywords

APPROXIMATION THEORY; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICES; SHEAR STRESS; SOLDERED JOINTS; THERMAL EXPANSION;

DIE ATTACH; NONISOTHERMAL; RAPID DIE HEATING (RDH); THERMOMECHANICAL STRESS;

DIELECTRIC HEATING;

EID: 4043105579     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.829903     Document Type: Article

References (8)

1. H.-D. Lee, "Interconnect technology: Copper and low-k dielectrics," in ICVC'99 6th Int. Conf. VLSI and CAD, vol. 26-27, Oct. 1999, pp. 201-201.
2. G. Wang et al., "Packaging effects on reliability of Cu/Low-A-interconnects," IEEE Trans. Device Mater. Reliabil., vol. 3, pp. 119-128, Dec. 2003.
3. K. Verma and B. Han, "Far-infrared Fizeau interferometry," Appl. Opt., vol. 40, no. 28, pp. 4981-4981, Oct. 2001.
4. K. Verma and B. Han, "Warpage measurement on dielectric rough surfaces of microelectronics devices by far infrared Fizeau interferometry," J. Electron. Packag. vol. 122, no. 3, pp. 227-232, 2000.
5. ABAQUS® User's Manual, Abaqus Inc., Pawtucket, RI, 2003.
6. B. A. Boley and J. H. Weiner, Theory of Thermal Stresses. New York: Wiley, 1960.
7. J. N. Goodier, "Thermal stresses and deformations," J. Appl. Mech., vol. 24, no. 3, pp. 467-474, 1957.
8. V. I. Danilovskaya. "Thermal stresses in elastic half-space arising after a sudden heating of its boundary," Prikl. Mat. Mekh., vol. 16, no. 3, pp. 341-344, 1952.