Control of overfill bumps in damascene Cu electrodeposition

ECS Transactions

Volumn 2, Issue 6, 2006, Pages 93-106

  Kim, S K ^a   Josell, D ^a   Moffat, T P ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; ELECTRODEPOSITION; ELECTROLYTES; FUNCTIONAL GROUPS; POLYETHYLENE GLYCOLS; VOLTAMMETRY;

DODECYLTRIMETHYLAMMONIUM CHLORIDE (DTAC); ELECTROANALYTICAL MEASUREMENTS; ION-PAIRING; VOLTAMMETRIC HYSTERESIS;

COPPER;

EID: 40249120203     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2408867     Document Type: Conference Paper

References (52)