Electrochemical mechanical planarization (eCMP) of copper thin films

ECS Transactions

Volumn 2, Issue 6, 2006, Pages 417-425

  Aksu, Serdar ^a   Uzoh, Cyprian ^a   Emesh, Ismail ^a   Başol, Bülent ^a  

^a ASM NuTool Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER COMPOUNDS; ELECTROCHEMISTRY; ELECTROPLATING; THROUGHPUT;

ELECTROCHEMICAL MECHANICAL PLANARIZATION (ECMP); ELECTROPLATING PROCESSES; PLATING PLATFORM;

THIN FILMS;

EID: 40249117279     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2408895     Document Type: Conference Paper

References (11)