In Situ stress measurements during copper deposition

ECS Transactions

Volumn 2, Issue 6, 2006, Pages 185-196

  Stafford, G R ^a   Kongstein, O E ^a   Beauchamp, C R ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; FILM THICKNESS; GRAIN BOUNDARIES; NUCLEATION; STRESS MEASUREMENT;

NUCLEATION DENSITY; NUCLEI COALESCENCE;

COPPER PLATING;

EID: 40249091909     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2408874     Document Type: Conference Paper

References (25)