Effect of a new thermal cycling method on bond strength of two-step self-etching adhesive systems

Dental Materials Journal

Volumn 26, Issue 5, 2007, Pages 635-641

  Nakata, Takashi ^a   Fujita, Megumi ^a   Nagano, Futami ^b   Noda, Mamoru ^b   Sano, Hidehiko ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

^b HOKKAIDO UNIVERSITY HOSPITAL   (Japan)

Author keywords

Microtensile bond strength; Thermal cycling; Two step self etching

Indexed keywords

EID: 40149108357     PISSN: 02874547     EISSN: None     Source Type: Journal    
DOI: 10.4012/dmj.26.635     Document Type: Article

References (26)