Continuous static recrystallization in ultrafine-grained copper processed by multi-directional forging

Materials Science and Engineering: A

Volumn 478, Issue 1-2, 2008, Pages 221-228

  Takayama, A ^a   Yang, X ^a   Miura, H ^a   Sakai, T ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Annealing; Continuous discontinuous recrystallization; Copper; Severe plastic deformation; Ultrafine grain

Indexed keywords

ANNEALING; FORGING; GRAIN GROWTH; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); STRAIN;

CONTINUOUS STATIC RECRYSTALLIZATION; MULTI-DIRECTIONAL FORGING; SEVERE PLASTIC DEFORMATION; ULTRAFINE GRAIN;

COPPER;

ANNEALING; COPPER; FORGING; GRAIN GROWTH; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); STRAIN;

EID: 39749150417     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.05.115     Document Type: Article

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