Multi-way principal component analysis for the endpoint detection of the metal etch process using the whole optical emission spectra

Korean Journal of Chemical Engineering

Volumn 25, Issue 1, 2008, Pages 13-18

  Han, Kyounghoon ^a   Park, Kun Joo ^b   Chae, Heeyeop ^c   Yoon, En Sup ^a  

^a Seoul National University   (South Korea)

^b DMS Co Ltd   (South Korea)

^c Sungkyunkwan University   (South Korea)

Author keywords

Endpoint detection; Multi way principal component analysis; Optical emission spectrometer; Plasma etching

Indexed keywords

EID: 39749139432     PISSN: 02561115     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11814-008-0003-8     Document Type: Article

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