Interconnect open defect diagnosis with minimal physical information

Proceedings - International Test Conference

Volumn , Issue , 2007, Pages

  Liu, Chen ^a   Zou, Wei ^b   Reddy, Sudhakar M ^a   Cheng, Wu Tung ^b   Sharma, Manish ^b   Tang, Huaxing ^b  

^a UNIVERSITY OF IOWA   (United States)

^b MENTOR GRAPHICS CORPORATION   (United States)

Author keywords

Defect location; Fault diagnosis; Interconnect opens; Via opens

Indexed keywords

DEFECTS; FAILURE ANALYSIS; FORMAL LOGIC; THRESHOLD VOLTAGE;

CIRCUIT PARAMETERS; DEEP SUBMICRON (DSM) DESIGNS; DEFECT LOCATION; INTERCONNECT OPENS;

INTERCONNECTION NETWORKS;

EID: 39749122166     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TEST.2007.4437580     Document Type: Conference Paper

References (24)