Perspective of low-power and high-speed wireless inter-chip communications for SiP integration

ESSCIRC 2006 - Proceedings of the 32nd European Solid-State Circuits Conference

Volumn , Issue , 2006, Pages 3-6

  Kuroda, Tadahiro ^a   Miura, Noriyuki ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITIVE COUPLING; CIRCUIT DESIGN; MICRO BUMPS; WIRELESS LINKS;

BIT ERROR RATE; COMMUNICATION SYSTEMS; COMPUTATION THEORY; DATA COMMUNICATION SYSTEMS; INTEGRATED CIRCUIT LAYOUT; TELECOMMUNICATION LINKS;

CHIP SCALE PACKAGES;

EID: 39549103814     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSCIR.2006.307522     Document Type: Conference Paper

References (12)