In situ monitoring of product wafers

Solid State Technology

Volumn 39, Issue 3, 1996, Pages 63-68

  Tepermeister, Igor ^a,d,e,f,g   Conner, William T ^a,e,f,h,i   Alzaben, Tawfeeq ^b,j,k   Barnard, Heather ^b,j   Gehlert, Kim ^c   Scipione, Don ^c  

^a Low Entropy Systems   (United States)

^b MOTOROLA INC   (United States)

^c HEWLETT PACKARD COMPANY   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^f Low Entropy Systems

^g LUCENT TECHNOLOGIES   (United States)

^h OBERLIN COLLEGE   (United States)

ⁱ UNIVERSITY OF WISCONSIN MADISON   (United States)

^j MOTOROLA INC   (United States)

^k Hitachi Semiconductor   (Belgium)

more..

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; QUALITY CONTROL; SENSORS; SOLID STATE DEVICES; STATISTICAL PROCESS CONTROL;

IN SITU WAFER STATE SENSOR; PRODUCT WAFERS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 3943090145     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. Garbriel G. Bama, Mehrdad M. Moslehi, Yong Jin Lee, Solid State Technology, p. 57 (April 1994).
2. Demetre J. Economou, Sang-Kyu Park, Gary D. Williams, J. Elecrochem. Soc. 136(1) p. 188 (January 1989).
3. Demetre Economou, Eray S. Aydil, Gabe Bama, Solid State Technology. p 107 (Aprl 1991).
4. Timothy J. Dalton, William T. Conner, Herbert H. Sawin, J. Electrochem. Soc., 141(7) P. 1893 (July 1994).
5. Ka Shun Wong, Duane Boning, Proceedings of the Electrochem. Soc., Reno, NV (1995).