A multi-scale approach to functional signature analysis for product end-of-life management

Quality and Reliability Engineering International

Volumn 20, Issue 5, 2004, Pages 457-467

  Di Bucchianico, Alessandro ^a,b   Figarella, T ^b   Hulsken, G ^c   Jansen, M H ^a,d   Wynn, H P ^b,e  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b EURANDOM   (Netherlands)

^c FLEXTRONICS INTERNATIONAL   (United States)

^d UNIVERSITY OF LEUVEN   (Belgium)

^e LONDON SCHOOL OF ECONOMICS   (United Kingdom)

Author keywords

Analysis of Variance; Multiscale analysis; Peak extraction; Signature analysis; Wavelet analysis

Indexed keywords

ASSEMBLY; COMPUTER AIDED ANALYSIS; COMPUTER SOFTWARE; CONDITION MONITORING; DEGRADATION; ELECTRONIC EQUIPMENT; ERROR ANALYSIS; FAILURE (MECHANICAL); INDUSTRIAL ECONOMICS; MATHEMATICAL MODELS; PRODUCT DEVELOPMENT; TECHNOLOGICAL FORECASTING; WAVEFORM ANALYSIS;

ANALYSIS OF VARIANCE (ANOVA); MULTISCALE ANALYSIS; PEAK EXTRACTION; SIGNATURE ANALYSIS; WAVELET ANALYSIS;

INDUSTRIAL MANAGEMENT;

EID: 3943084841     PISSN: 07488017     EISSN: None     Source Type: Journal    
DOI: 10.1002/qre.659     Document Type: Conference Paper

References (7)

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3. Figarella T. Signature analysis: Modelling the characteristics of the main tray of the Lake finishers. Master of Technological Design Thesis, Eindhoven University of Technology, Eindhoven, 2003.
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